Huawei targets advanced chips despite US sanctions

Huawei Technologies plans to develop industry-leading semiconductors within five years, despite US sanctions that restrict China’s access to advanced chipmaking equipment. 

At a semiconductor symposium in Shanghai, Huawei said its future chips could achieve transistor density equivalent to 1.4-nanometre technology by 2031. 

China’s most advanced proven chips are currently around 7 nanometres, while Taiwan’s TSMC plans mass production of 1.4-nm chips in 2028.

New strategy
Huawei unveiled a new principle called the Tau Scaling Law, which focuses on improving chip performance by reducing data-transfer delays and shortening internal wiring instead of only shrinking transistors.

Analysts say the approach could help China overcome restrictions on advanced lithography tools. Huawei added that its upcoming Kirin smartphone chips and Ascend AI processors will use a Tau Scaling architecture ‌called LogicFolding.

AI boom raises competition
Demand for Huawei’s Ascend chips has surged as Chinese companies seek alternatives to US chip giant Nvidia, whose advanced AI chips face export restrictions in China. 

Huawei said it has already mass-produced 381 chips using Tau Scaling technology over the past six years.